Electrical testing for semiconductor package substrates - full panel size inspection available.
Full panel size support! A high-capacity, high-speed, and high-precision inspection solution compatible with a maximum point count of 24Kch.
We would like to introduce our high-speed and high-precision inspection equipment for semiconductor packages, the 'GATS-7885'. This electrical inspection system achieves high-speed and high-precision probing for electrical testing of FOPLP/RDL using glass carriers. 【Features】 ■ Capable of inspecting full panel size (510×515 mm) ■ Supports up to 24K channels on the upper side ■ Overall alignment accuracy of ±3.5 μm ■ Capable of two types of RSD inspections ■ Compliant with SEMI standards *For more details, please download the PDF or feel free to contact us.
- Company：ニデックアドバンステクノロジー 本社、東京営業所、名古屋営業所
- Price：Other
